English

教授（正高职）

工学网群

张志伟

职　　称：研究员
职　　务：
专　　业：固体力学
所在系所：力学与工程科学系/ 固体力学研究所
通讯地址：甘肃省兰州市天水南路222号兰州大学土木工程与力学学院，730000
电子信箱： zhangzhiwei@lzu.edu.cn
联系电话：
传　　真：
主要学历
2012.09—2016.06 武汉科技大学，工程力学，获工学学士学位
2016.09—2019.06 北京工业大学，力学，获工学硕士学位 （导师：陈沛 副教授）
2019.09—2022.06 中国科学院力学研究所，固体力学，获理学博士学位 （导师：白以龙 院士，王军 副研究员）
主要学术经历
2022.08— 2024.09 兰州大学，土木工程与力学学院，萃英博士后 （合作导师：周又和 院士，张兴义 教授）
2024.10— 至今 兰州大学，土木工程与力学学院，青年研究员
主要研究方向
电磁固体力学、超导实验力学、纳米结构与材料的物理力学、微纳米力学
主要讲授课程
招生专业
0801力学，080102固体力学
欢迎力学、物理、材料、机械等专业学生报考
主要学术成就、奖励及荣誉
2022.06 中国科学院院长特别奖
2022.04 中国科学院力学研究所郭永怀一等奖学金
2021.11 博士研究生国家奖学金
2021.01 北京力学会第二十七届学术年会优秀论文奖
2019.06 北京市优秀硕士毕业生
2019.06 北京工业大学优秀硕士毕业生
主要科研项目及角色

1.2024.01—2026.12  A15型超导材料临界电流随应变退化机理及调控的实验研究，国家自然科学基金委员会, 青年基金项目（12302241），主持。
2.2023.07—2024.06  素化强韧镍基超合金的力学机制研究，甘肃省科技计划项目，在站博士后专项（23JRRA1118），主持。 
3.2025.01—2028.12  基于固体传导冷却的无液氦射频超导关键问题研究，国家自然科学基金委员会，区域创新发展联合基金重点项目，参与（合作单位负责人）。
4.2024.10—2026.10  力学-超导相互作用的非线性力学，甘肃省科技领军人才项目(2 4RCKB008)，参与。
5.2018.01—2021.12  采用纳米尺度堆垛层错突破单晶强度研究，国家自然科学基金委员会, 面上项目（11772332），参与。
6.2016.01—2018.12  减薄晶圆损伤层残余应力和力学性能测量方法研究，国家自然科学基金委员会, 青年基金项目（11502005），参与。

代表性论著

代表性论著：
[1]Z.W. Zhang*, X.Y. Zhang, R. Yong, J. Wang*, C.S, Lu, “The Ni3Al/Ni interfacial contribution to indentation size effect of Ni-based single crystal superalloys”, Solids, 2024, Minor revision.    
[2]Z.W. Zhang*, X.Y. Zhang, R. Yong, J. Wang*, C.S, Lu, “Deformation mechanisms dominated by decomposition of an interfacial misfit dislocation network in Ni/Ni3Al multilayer structures”, Materials, 17 (2024), 4006.    
[3]Q.T. Ran, Z. Jing, L. Shen, J. Zhou, C. Liu, Z.W. Zhang, X.Y. Zhang*, Suppression of flux avalanches in YBCO superconducting thin films by eddy currents, Superconductivity, 11 (2024), 100101. （封面论文）
[4]R. Zhang, Z.W. Zhang*, X.Y. Zhang*, “Fracture mechanisms and suppressed temperature effects of YBCO superconducting materials dominated by grain boundaries”, Engineering Fracture Mechanics, 303 (2024), 110139. (遴选为Advances in Engineering关键科学文章)
[5]J.B. Yang, Y.H. Li, J.H. Deng, Z.W. Zhang, J. Zhou, X.Y. Zhang*, “Novel Speckle Preparation and Heat Insulation Method for DIC Strain Measurement at Cryogenic Temperature and Large Deformation Environment”, Experimental Mechanics, 64 (2023), 73–84. （封面论文）
[6]L. Jiang, Z.W. Zhang*, Z. Yu, J. Zhou, H.D. Yong, X.Y. Zhang*, “Fatigue behaviors and damage mechanisms for Nb3Sn triple-helical structure at extremely low temperature”, Superconductivity, 8 (2023), 100065.
[7]Y.H. Li, N.N. Mu, S.Y. Tang, Z.W. Zhang, J. Zhou, H.D. Yong, X.Y. Zhang*, “Deformation and crack prediction of CORC cable induced by Poisson effect: Theoretical modeling and experimental validation”, Engineering Fracture Mechanics, 292 (2023), 109625.
[8]Z.W. Zhang, W. Cai, Y.H. Feng, G.H. Duan, J. Wang, J. Wang*, R. Yang, P. Xiao, F.J. Ke and C. Lu*, “Dislocation reactions dominated pop-in events in nanoindentation of Ni-based single crystal superalloys”, Materials Characterization, 200 (2023), 112883.
[9]R.H. Shi*, Y.C. Wu, F. Shuang, Z.W. Zhang, “Dipolar and quadrupolar characteristics of shear transformation in two dimensional metallic glasses”, Materials Today Communications, 34 (2023) 105389.
[10]Z.W. Zhang, W. Cai, J. Wang*, R. Yang, P. Xiao, F.J. Ke and C. Lu*, “Theoretical model for yield strength of monocrystalline Ni3Al by simultaneously considering the size and strain rate”, Transactions of Nonferrous Metals Society of China, 33 (2023), 816–823.
[11]Z.W. Zhang, Q. Fu, J. Wang*, R. Yang, P. Xiao, F.J. Ke and C. Lu, “Simultaneously achieving strength and ductility in Ni3Al nanowires with superlattice intrinsic stacking faults”, International Journal of Mechanical Sciences, 215 (2022), 106953
[12]Z.W. Zhang, Q. Fu, J. Wang*, R. Yang, P. Xiao, F.J. Ke and C. Lu, “Interaction between the edge dislocation dipole pair and interfacial misfit dislocation network in Ni-based single crystal superalloys”, International Journal of Solids and Structures, 228 (2021) 111128.
[13]Z.W. Zhang, Q. Fu, J. Wang*, R. Yang, P. Xiao, F.J. Ke and C. Lu, “Atomistic modeling for the extremely low and high temperature-dependent yield strength in a Ni-based single crystal superalloy”, Materials Today Communications, 27 (2021) 102451.
[14]Z.W. Zhang, Q. Fu, J. Wang*, R. Yang, P. Xiao, F.J. Ke and C. Lu, “Interaction between butterfly-like prismatic dislocation loop pairs and planar defects”, Physical Chemistry Chemical Physics, 23 (2021) 10377–10383
[15]Z.W. Zhang, Q. Fu, J. Wang*, P. Xiao, F.J. Ke and C. Lu, “Hardening Ni3Al via complex stacking faults and twinning boundary”, Computational Materials Science, 188 (2021), 110201.
[16]T Wei, Z.H. Zhang, Z.M. Wang, Q. Zhang, Y.S. Ye, J.H. Lu, Z.U. Rahman, Z.W. Zhang, “Ultrathin solid composite electrolyte based on Li6.4La3Zr1.4Ta0.6O12/PVDF-HFP/ LiTFSI/succinonitrile for high-performance solid-state lithium metal batteries”, ACS Applied Energy Materials, 3 (2020), 9428–9435.
[17]P. Chen*, Z.W. Zhang, C.S. Liu, T. An, H.P. Yu, F. Qin, “Temperature and grain size dependences of mechanical properties of nanocrystalline copper by molecular dynamics simulation”, Modelling and Simulation in Materials Science and Engineering, 27 (2019), 065012.
[18]P. Chen*, Z.W. Zhang, T. An, H.P. Yu, F. Qin, “Generation and distribution of residual stress during nano-grinding of monocrystalline silicon”, Japanese Journal of Applied Physics, 57 (2018), 121302.
[19]Z.W. Zhang, P. Chen*, T. An, H.P. Yu, F. Qin, “Mechanical properties of silicon in subsurface damage layer from nano-grinding studied by atomistic simulation”, AIP Advances, 8 (2018), 055223. 
[20]C.S. Liu, P. Chen*, Z.W. Zhang, “Simulation of force, energy, and surface integrity during nanometric machining by molecular dynamics”, Machining and Tribology, Elsevier, Amsterdam, Netherlands, 2021.10, Chapter 7. ISBN: 9780128198896. (专著章节)
[21]P. Chen*, Z.W. Zhang, F. Qin, “Study of interfacial tensile and shear strength for Cu/Ta interface by molecular dynamic simulation”, 20th International Conference on Electronic Packaging Technology, HongKong, China, IEEE, 2019. (EI)
[22]Z.W. Zhang, P. Chen*, F. Qin, “Molecular dynamic simulation of grain size and work temperature effect on mechanical properties of polycrystalline copper”, 19th International Conference on Electronic Packaging Technology, Shanghai, China, IEEE, 2018, 228–232. (EI)
[23]Z.W. Zhang, P. Chen*, F. Qin, “Molecular dynamics simulation on subsurface damage layer during nano grinding process of silicon wafer”, 18th International Conference on Electronic Packaging Technology, Harbin, China, IEEE, 2017, 1133–1137. (EI)

学术会议：
[1]张志伟, “纳米尺度界面结构强韧镍基单晶超合金探索”, 中国材料大会2024暨世界材料大会, 2024, 7, 广州. 
[2]张瑞, 张志伟*, 张兴义, “YBCO超导材料中晶界主导的力学变形机理研究”, 中国材料大会2024暨世界材料大会, 2024, 7, 广州. 
[3]刘长生，张瑞，张志伟*，张兴义, “化学短程有序对316LN中Hall-Petch关系的强化效应”, 中国材料大会2024暨世界材料大会, 2024, 7, 广州. 
[4]张志伟, “面缺陷强韧镍基超合金的原子机制”, 中国力学大会(CCTAM-2021+1), 2022, 12.
[5]张志伟, “Ni3Al素化增强增韧增硬的分子机制”, 北京力学会第二十七届学术年会, 北京, 2021, 3. （优秀论文奖）
[6]张志伟, “纳米结构化镍基单晶力学性能研究”, 首届全国力学博士生学术论坛, 北京, 2020, 11.
[7]P. Chen*, Z.W. Zhang, F. Qin, “Study of interfacial tensile and shear strength for Cu/Ta interface by molecular dynamic simulation”, 20th International Conference on Electronic Packaging Technology, HongKong, China, 2019.8. 
[8]Z.W. Zhang, P. Chen*, F. Qin, “Molecular dynamic simulation of grain size and work temperature effect on mechanical properties of polycrystalline copper”, 19th International Conference on Electronic Packaging Technology, Shanghai, China, 2018.8. 
[9]Z.W. Zhang, P. Chen*, F. Qin, “Molecular dynamics simulation on subsurface damage layer during nano grinding process of silicon wafer”, 18th International Conference on Electronic Packaging Technology, Harbin, China, 2017.8.